EnSilica (AIM:ENSI) told investors it has converted a feasibility study into a US$2.4 million ASIC development and supply agreement with a US healthcare technology customer, and separately completed tape-out on a next-generation chip for a UK-listed life-sciences customer under a previously disclosed US$1.6 million contract.
The AIM-listed, Oxford-based fabless chipmaker designs application-specific semiconductors for space, communications, industrial, healthcare and automotive customers, and both programmes were first announced in March.
The healthcare contract covers a wireless biosensing and therapeutic controller chip, intended for a device using cloud-based artificial intelligence to treat a chronic condition EnSilica says affects tens of millions of people in the US and hundreds of millions worldwide.
EnSilica will run the full ASIC development programme over an expected 18 months, and the agreement also sets a framework for it to supply the chip across the product's commercial lifetime, which the company flags as a potential recurring revenue opportunity.
On the life-sciences side, the US$1.6 million contract covers design implementation, tape-out management and prototype wafer manufacturing for a chip used in advanced life-science analysis systems; with tape-out now complete, the design moves to fabrication at a foundry, and EnSilica expects most of that contract's revenue to land in the financial year ending 31 May 2027.
"We are delighted to have converted the feasibility study for our healthcare customer, announced in March, into a multi-year development and supply agreement," said chief executive Ian Lankshear, adding that completing tape-out on the life-sciences chip "underlines our team's ability to execute complex design and manufacturing chip programmes."
Read more about EnSilica
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The healthcare and life-sciences wins extend a pattern from EnSilica's last full year, when it reported revenue of £27.8 million, a swing to pre-tax profit of £2.2 million, five ASICs already in volume production and fourteen further chip programmes in design, alongside guidance that more than 80% of anticipated FY27 revenue is already visible from existing contracts and supply agreements.