EnSilica (AIM:ENSI) has won two multi-chip development contracts with a leading European satellite operator to develop chips for its next-generation satellite network, with the user-terminal elements alone potentially worth more than $50m from 2030.
EnSilica, the fabless chipmaker serving space and communications, industrial, automotive and healthcare markets, said the contracts span both satellite payload and user-terminal silicon and include ASIC and ASSP solutions.
Initial non‑recurring engineering (NRE) revenues are $6.8m starting this financial year and running into FY2028, and the work could unlock up to $3m of matched funding from the UK Space Agency.
"The award provides significant industry validation for EnSilica and we are very proud of our technology being selected for this major Space programme," said Ian Lankshear, Chief Executive Officer.
A funded study for the payload chip has moved into development, while future supply revenues for that element remain to be agreed.
The programme is planned to progress through phased development over the next two and a half years, with long‑term semiconductor supply revenues expected as the network is deployed towards initial services at the end of the decade.
