Transense Technologies (LSE:TRT) has taken delivery of a bespoke, high-precision die bonding machine following a £0.4m investment to accelerate commercial scale-up of its SAWsense sensor production.
The purchase raises total capital invested in the pilot SAW sensor installation line to more than £1m and was paid for from internally generated cash flow, supplemented by an asset-backed financing facility to provide additional headroom.
The automated die bonder delivers micron-level placement of SAW sensing elements onto shafts and components, supporting repeatable installations suitable for volumes “from hundreds of thousands to millions of units per year” and reducing adoption barriers for customers in robotics, aerospace and automotive.
SAWsense already supplies and licences technology to GE Aerospace, Motion Applied and Airbus, among other confidential OEM and Tier 1 customers. The equipment follows an 18-month development programme, including trials at Newcastle University’s Driving the Electric Revolution Industrialisation Centre to define a production-ready process.
"This investment marks an important milestone for SAWsense as we transition from development into scalable manufacturing capability," Ryan Maughan, Managing Director, said.