EnSilica (AIM:ENSI), the fabless microchip maker serving Space & Comms, Industrial, Automotive and Healthcare, said it has completed production tape-out on the Edge AI ASIC, first announced on 15 July 2024, which triggers the recognition of a US$5m non-recurring engineering and tape-out fee across FY2026 and FY2027.
The customer forecasts the chip will become one of the largest revenue-generating contracts in EnSilica's portfolio, with first silicon samples anticipated in 2026 and volume production expected during calendar year 2027, and estimated revenues of up to US$50m over five years once full-scale production commences.
"This milestone is a key step on the path to full‑scale production of our first chip within the significant growth market of Edge AI processing," Ian Lankshear, Chief Executive Officer, said.
With tape-out complete, three additional ASICs are now expected to join the five ASICs currently in volume production over the next 18 months, and a further eleven active ASIC and ASSP programmes continue to progress through design and development.
EnSilica said progress on the supply contract has been led by the customer's schedule and that the successful tape-out strengthens its pipeline of recurring semiconductor supply revenues.
